Miniaturization of technology is moving apace in the world of audio, as surface-mount speakers and tiny microphones mean electronics are getting smaller while performance expands. SonicEdge Ltd creates innovative audio components designed to fit into extremely small spaces.
The company’s products use the same silicon technology found in miniature devices that use the same reliable silicon technology that powers billions of smart devices around the world. Whether it’s smartphones or cars, these tiny components can be used to create high-quality audio products on a large scale.
Like most technology, the components that make SonicEdge improve with each generation, doubling the amount of sound output from the same small space every two years. By combining multiple audio functions into single, compact packages, Sonic Edge manages to improve performance by pushing what’s possible in audio technology, producing solutions that deliver high-quality sound with innovative features in ever-smaller designs.
SonicEdge will announce the launch of SonicTwin at CES 2025. SonicTwin is described as the world’s smallest built-in speaker microphone in a single package, designed specifically for use in True Wireless Stereo headphones and earphones. Measuring a tiny 8 x 4 x 1mm, SonicTwin combines innovative sound generation and sensing capabilities, which the company claims sets a new benchmark in compact audio innovation.
Powered by SonicEdge’s patented ultrasonic modulated technology, SonicTwin eliminates traditional mechanical vibrations, enabling seamless integration of speakers and sensors. This breakthrough produces extremely high sound pressure levels in a small form factor, changing what’s possible for TWS headphones and wearables like fitness watches. Engineering samples of the new SonicTwin will become available in 2025 and should begin appearing in consumer audio products in 2026.
“SonicTwin is a game changer,” asserts Moti Margalit, CEO and founder of SonicEdge. “It unlocks immersive, integrated audio solutions and sets a new standard for wearables and beyond. Its ultra-compact size enables true ear canal integration, providing unmatched performance, comfort and active noise cancellation (ANC) for TWS headphones and earphones. With SonicTwin, manufacturers can design smaller devices or allocate more space for larger batteries, providing unprecedented freedom in product design.
Traditional active noise cancellation systems found in many wireless headphones can often suffer from what is known as “potential sound syndrome” where users experience a hollow, tunnel-like sound quality, like listening to audio through a can. This phenomenon occurs due to the acoustic resonance produced in the closed space of the headset and the interference between the speakers and microphones located nearby.
“SonicTwin marks the end of ‘sound syndrome,'” said Ari Mizrachi, CTO and co-founder of SonicEdge. “Our modulated ultrasound technology replaces traditional voice coils, resulting in higher efficiency, superior sound quality and co-packaged sensors – all in a size once thought impossible.”
SonicTwin transforms the manufacturing process. By reducing the number of components required, it minimizes complexity in the production line, speeding up the time it takes to bring a product to market. As part of SonicEdge’s portfolio of MEMS-based products, SonicTwin points the way to the next generation of integrated speaker sensor solutions that can be used to power applications in sectors such as environmental awareness and health monitoring.